Designed as a fully modular platform, the EVG150 provides automated spin/spray/develop processes with high throughput. A new ultra-compact design with footprint < 3 m2 and redesigned modules enables easy access of individual chambers as well as the robot area. To minimize downtime, single modules can be serviced while the remaining system can be kept up and running. The system features four wet processing modules and up to 20 bake/chill units. Outstanding throughput values for real-life processes can be achieved by using a high-speed, high-accuracy robot and advanced scheduler algorithms. Even though the system exhibits a very compact design, up to 12 pumps and resist bottles can be installed inside the main frame. The EVG150 guarantees highly uniform coats ranging from demanding thick resist applications down to sub-micron layers.
Wafers with high topography can be uniformly coated by EVG’s proprietary OmniSpray ultrasonic atomization technology, where traditional coating encounters limitations. Up to four XY spray coat modules can be installed in the system, which allows unrivalled spray coating throughput.
Versatile combinations of multi-functional modules provide great opportunities in many fields of application like MEMS, image sensors, advanced packaging, RF, 5G, 3D sensing, photonics, automotive and power electronics manufacturing.
Wafer diameter (substrate size) |
---|
up to 200 mm |
Available modules |
---|
Spin coat / OmniSpray® / Develop |
Bake / Chill / Vapor Prime |
Wafer handling options |
---|
Double EE / edge handling |
Bowed / warped / thin wafer handling |
Dispense options |
---|
Various resist dispense pumps to cover a wide range of viscosities up to 52000 cP |
Constant pressure dispense systems |
EBR / BSR / pre-wet / liquid priming |
Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processes and high-throughput performance. The EVG150 guarantees highly uniform coats and improved repeatability. Wafers with high topography can be uniformly coated by EVG’s OmniSpray technology, where traditional spin coating encounters limitations.
Number of modules |
---|
Process modules: up to 6 |
Bake / chill modules: up to 20 |
Industrial automation features |
---|
Ergo load cassette stations / SMIF loadports / SECS/GEM / FOUP load ports |
Smart process control & data analysis features (framework SW platform) |
---|
Integrated analysis features for process and machine control |
Parallel task / queueing task processing feature |
Equipment and process performance tracking feature |
Smart handling features |
Occurences & alarms analysis / smart maintenance management & tracking |
Wafer diameter (substrate size) |
---|
Up to 300 mm |
Available modules |
---|
Spin coat / OmniSpray® / develop |
Bake / chill |
Wafer handling options |
---|
Single/double EE / edge handling / wafer flipping |
Bowed / warped / thin wafer handling |
Dispense options |
---|
Various resist despense pumps to cover a wide range of viscosities up to 52000 cP |
Liquid priming / pre-wet / bowl wash |
Edge bead removal (EBR) / back-side rinse (BSR) |
Constant pressure dispense systems / syringe dispense system |
Resist dispense pump features flowmonitoring |
---|
Programmable dispense rate / programmable volume / programmable suck-back |
Ultrasonic |
Additional module options |
---|
Pre-alignment: optical / mechanical |
ID-reader: barcode, alpha-numeric, data matrix |
System control |
---|
Operations system: Windows |
File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor |
Flexible process flow definition / easy drag and drop recipe programming |
Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting |
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |
Contact the EVG experts