EV Group | Semiconductor Manufacturing Equipment and Process Solutions for Wafer Bonding, Optical Lithography, Nanoimprint Lithography, Resist Processing and Metrology

ZH 中文 (ZH)

选择您的语言

ZH 中文 (ZH)

EV Group doubles the throughput of innovative Semiconductor Layer Transfer Technology with the new EVG®880 LayerRelease™ System

Silicon Austria Labs and EV Group strengthen Collaboration in Optical Technology Research

“Backside power delivery: The new frontier for wafer bonding.” – Read Paul Lindner's executive viewpoint in Chip Scale review

发明-创新-实施

我们的Triple i理念体现在整个公司对技术的热情、创新实力和国际化。我们的愿景是“率先探索新技术，为微纳米制造技术的下一代应用服务”，这使我们的客户能够成功地将他们的新产品理念商业化。

用于大规模制造微电子和纳米电子产品行业领先的晶圆加工设备

解决关键光刻、晶圆键合和量测要求的核心技术和工艺技术

Become an Insider

1400

员工

子公司及办事处