Thin wafer debonding
The EVG805 is a system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
Features
- Open adhesive platform
- Debond Options:
- Thermal slide off debonding
- Lift off debonding
- Mechanical debonding
- Recipe controlled system
- Real time monitoring and recording of all relevant process parameters
- Unique features for thin-wafer handling
- Various chuck designs to support wafer/substrates and carriers up to 300 mm
- High topography wafer handling
Technical Data
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm wafer |
| Up to 12” film frame |
| Configuration |
|---|
| 1 debond module |
| Options |
|---|
| UV-assisted debonding |
| High topography wafer handling |
| Bridge capability for different substrate sizes |
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