EVG®620 NT

Smart NIL® UV Nanoimprint Lithography System

Mask alignment system with UV Nanoimprint Lithography capability featuring EVG´s proprietary SmartNIL® technology up to 100 mm

Known for its flexibility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service support makes them the ideal solution for any R&D environment up to semi-automated volume production. The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode. Furthermore, the EVG’s proprietary SmartNIL technology is supported.

SmartNIL is the industry leading NIL technology, enabling the patterning of extremely small features down to less than 40 nm*, as well as a wide range of structure sizes and shapes. SmartNIL in combination with multi-use soft-stamp technology enables unmatched throughput with considerable cost-of-ownership advantages while preserving scalability and maintenance-friendly operation. EVG’s SmartNIL redeems the long-term promise of nanoimprinting being a low-cost and high-volume alternative lithography technology for mass manufacturing of micro- and nanoscale structures.
*resolution dependent on process and template 

Features

  • Top-side and bottom-side alignment capability
  • High-precision alignment stage
  • Automated wedge compensation sequence
  • Motorized and recipe controlled exposure gap
  • Supports the latest UV-LED technology
  • Minimized system footprint and facility requirements
  • Step-by-step process guidance
  • Remote tech support
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Agile processing and conversion re-tooling
  • Table top or stand-alone version with anti-vibration granite table
  • Additional capabilities:
    • Bond alignment
    • IR alignment
    • SmartNIL 
    • µ-contact printing

Technical Data

Wafer diameter (substrate size)
Standard lithography: pieces up to 150 mm
Soft UV-NIL: pieces up to 150 mm
SmartNIL®: up to 100 mm
Resolution
≤ 40 nm (resolution dependent upon template and process)
Supported Process
Soft UV-NIL & SmartNIL®
Exposure source
Mercury light source or UV LED light source
Alignment
Soft-NIL: ≤ ± 0.5 µm
SmartNIL®: ≤ ± 3 µm
Automated separation
Soft UV NIL: not supported
SmartNIL®: supported
Working stamp fabrication
Soft UV-NIL: external
SmartNIL®: supported

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