IR and bond strength measurement of bonded wafer stacks
The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes. In addition, the infrared inspection system supports bond strength measurements using the Maszara method.
Features
- IR live image
- One-shot high-resolution inspection of the entire bonded wafer
- Optional bond pin for live visualization of bond wave propagation
- Fully automated bond strength measurement (Maszara test)
- Void size detection down to 500 µm radius
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