High-Speed High-Precision Metrology for 3D and Heterogeneous Integration
The EVG®40 NT2 automated metrology system provides overlay and critical dimension (CD) measurements for wafer-to-wafer (W2W), die-to-wafer (D2W) and die-to-die (D2D) bonding as well as maskless lithography applications. Designed for high-volume production with feedback loops for real-time process correction and optimization, the EVG40 NT2 helps device manufacturers, foundries and packaging houses accelerate the introduction of new 3D/heterogeneous integration products as well as improve yields and avoid scrapping of highly valuable wafers.
Features
- Highly precise measurements of critical bonding and lithography process parameters for current and future leading-edge 3D / Heterogeneous Integration applications
- Alignment verification and monitoring for W2W, D2W, D2D
- Alignment verification for maskless exposure processes
- CD measurement and multi-layer thickness measurement
- Highly scalable system that features multiple measurement heads and a high-precision stage designed for high-throughput and high-accuracy (down to the low single-digit nm range)
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