Versatile, high-accuracy metrology for bonding and lithography
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy.
Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.
As an application example, the EVG40 NT completes EVG’s product range for highly accurate aligned wafer bonding as the tool of record for reliably verifying the 100 nm bond overlay accuracy of EVG’s GEMINI FB automated fusion bonding system.
Features
- Versatile measurement options for lithography and bonding metrology
- Alignment verification for bonding and lithography applications
- Top- to bottom-side microscope for manifold measurement methods
- Critical dimension (CD) measurement
- Die-to-die alignment verification
- Multi-layer thickness measurement
- High measurement accuracy in vertical and lateral direction
- High throughput due to specialized calibration routine
- PC-based measurement and pattern recognition software for highest reliability
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