Manual bond alignment system for wafer-to-wafer alignment suitable for academia and industrial research
The EVG610 bond alignment system offers a manual high-precision alignment stage with bottom-side microscope. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Features
- Most suitable for EVG®501 and EVG®510 bonding systems
- Wafer and substrate sizes up to 150 / 200 mm
- Manual high-precision alignment stage
- Manual-operated bottom-side microscope
- Windows® based user interface
- Perfect multi-user concept (unlimited number of user accounts, various access rights, different user interface languages)
- Desktop system design with minimum footprint
- Supports IR alignment process
- Optimum total cost of ownership (TCO) for R&D and pilot line production
Technical Data
| General system configuration |
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| Desktop |
| System rack: optional |
| Vibration isolation: passive |
| Alignment methods |
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| Backside alignment: ± 2 µm 3 σ |
| Transparent alignment: ± 1 µm 3 σ |
| IR alignment: option |
| Alignment stage |
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| Precision micrometers: manual |
| Optional: motorized micrometers |
| Wedge compensation: automated |
| Substrate / Wafer parameters |
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| Size: 2", 3", 100 mm, 150 mm, 200 mm |
| Thickness: 0,1 - 10 mm |
| Max. stack height: 10 mm |
| Automatic alignment |
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| Optional |
| Handling system |
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| Standard: 2 cassette stations |
| Optional: up to 5 stations |
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