Fully automated wafer bonding system for high-volume manufacturing
The EVG560 automated wafer bonding system is a highly configurable production bonder. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.
Features
- Fully automated processing with automated loading and unloading of bond chucks
- Up to four bond chambers for various bonding processes
- Compatible with EVG mechanical and optical aligner including SmartView
- Simultaneous rapid heating and cooling on top and bottom side
- Automatic loading and unloading of bond chambers and cooling station
- Remote online diagnostics
Technical Data
| Maximum heater size |
|---|
| 150, 200, 300 mm |
| Loading chamber |
|---|
| 5-axis robot |
| Max. bond modules |
|---|
| 4 |
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