Events

ICEP 2025

Listen to our talks "Wafer Bonding Advances & 3D Applications" held by our Representative Director Hiroshi Yamamoto on 9:30 Wednesday, April 16 / Room B and "Hybrid Bonding for Heterogenous Integration" held by our Process Technology Manager Europe Gerald Mittendorfer on 12:40 Friday, April 18 / Room A.

15.04. - 19.04.2025

Nagano, Japan

JFS Conference and Compoundsemiconductor Industry Expo 2025

Visit our booth #A308

23.04. - 25.04.2025

Wuhan, China

MicroNanoFabrication Annual Review Meeting 2025

Visit our booth at the MicroNanoFabrication Annual Review Meeting 2025!

13.05. - 13.05.2025

Ecublens, Switzerland

Semicon South East Asia 2025

Visit our booth #L1300!

20.05. - 22.05.2025

Singapore, Singapore

ECTC 2025

Visit our booth #330 and our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects" held by Dr. Viorel Dragoi on 27th of May!

27.05. - 30.05.2025

Dallas, USA

Leti Innovation Days 2025

Visit us at our booth at the Leti Innovation Days 2025!

17.06. - 19.06.2025

Grenoble, France

Laser World of Photonics 2025

Visit our Booth B1.141!

24.06. - 27.06.2025

Munich, Germany