Events

ICEP-HBS 2026

Listen to our talks:

“Hybrid Bonding and Interconnect Scaling: Driving Application Performance, Power and Cost by Mixing and Matching Semiconductor Technologies” by Representative Director Hiroshi Yamamoto.

“A predictive model for bond strengthening based on ion characteristics and the interface evolution in plasma activated fusion and hybrid bonding” by Deputy Team Leader Process Technology David Doppelbauer.

“From Scaling to Stacking: How Fusion and Hybrid Bonding enable Next-Generation High Performance Chip Architectures” by Business Development Manager Thomas Pleschke.

For more information click here.

Merck "The Future of Photonics — Materials Matter"

Listen to our talk “Enabling Scalable Photonic Packaging using Nanoimprint Lithography” held by Business Development Manager Andrea Kronawitter.

More information here.

CS / PIC / PE International Conference 2026

Visit us at our booth at the CS / PIC and PE International Conference and listen to our talks:

"High performance GaN power devices enabled by wafer bonding" held by Business Development Manager Elisabeth Brandl at the CS Conference.

"Advancing Photonic Packaging and Integration Through UV Nanoimprint Lithography" held by Senior Process Technology Engineer Patrick Schuster at the PIC Conference.

Lange Nacht der Forschung 2026

On Friday, April 24, 2026, we will once again open our doors from 5:00 p.m. to 11:00 p.m. and invite everyone interested to take a look behind our glass facade and discover the fascinating world of EVG!

You'll find more Information here.

Semicon South East Asia 2026

Visit our booth #1126!

9th International Workshop on Low Temperature Bonding for 3D Integration LTB-3D 2026

Listen to our talk “Xenon vs Argon Ion Activation for Room‑Temperature Wafer Bonding of Si and SiC” held by Senior Process Technology Engineer Peter Kerepesi.

More information here.

ITF World 2026

Visit our booth at ITF World 2026!

ECTC 2026

Visit our booth #220 and visit our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging" on Tue, May, 26 and listen as well to our talk “Digital Lithography Patterning of Novel Dry Film Resists for High Aspect Ratio Cu Pillar Applications on 310x310mm2 Panel Substrates” held by Business Development Manager Dr. Ksenija Varga on 29th of May. 

Here you'll find more information on the program.

NIL Industrial Day 2026

Visit our Booth and listen to our talk "Leveraging NIL and Etching to Enable Next Generation Photonic Devices” held by Senior Process Technology Engineer Patrick Schuster.

For more information follow the link.  

Leti Innovation Days 2026

Visit us at our booth at the Leti Innovation Days 2026!