Events
Semicon Korea
Visit our booth #C740 and listen to our talks “EVG LayerRelease Technology ; Key Innovations in Carrier Systems: Addressing D2W and W2W Stacking Requirements” held by Corporate Sales & Marketing Director Dr. Thomas Uhrmann and “High Throughput Digital Lithography Development Enables AI and HPC Device Integration” by Business Development Manager Dr. Ksenija Varga.
SPIE Advanced Lithography & Patterning 2026
Visit our booth #616 and listen to our talks
on February 25th: “High aspect ratio copper pillar structures enabled by digital lithography patterning of thick resists for AI and HPC device packages” presented by Dr. Ksenija Varga.
on February 26th:"Ultrasonic spray coating combined with maskless lithography for advanced wafer singulation with complex bump geometries" held by Johanna Rimböck and “Lithography Digitalization in Semiconductor Technologies Through Advanced Software Development of High Throughput Maskless Exposure” held by Alois Malzer.
IMAPS Device Packaging 2026
Visit EVG at booth #505
SEMICON China 2026
Meet EVG at booth #3387 at SEMICON China 2026!