Products

EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners, its newly developed maskless exposure lithography systems and the in-house process knowledge of its resist processing systems. 

EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2-inch compound semiconductor wafers to 300 mm wafers and even on large-area panels. 

With our long-term experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding.

EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.

Process know-how is key to achieving the shortest time to market for your product. EVG provides support for initial development through final integration at the customer’s site.