Mask Alignment Systems

EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.

Accommodating wafers and substrates up to 300 mm, varying in size, shape and thickness, EVG’s mask alignment systems aim to provide sophisticated solutions with a high grade of automation for advanced applications and full flexibility for research and development. EVG’s mask aligners as well as process competencies are field proven and installed in production facilities around the globe to support numerous applications, including advanced packaging, compound semiconductor, power device, LED, sensor and MEMS manufacturing.