EV Group Appoints Dr. Thomas Uhrmann Vice President of Sales

ST. FLORIAN, Austria, April 30, 2025 — EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the appointment of Dr. Thomas Uhrmann as vice president of sales, effective May 1, 2025. An industry veteran with extensive experience in semiconductor processing and advanced packaging technologies and market development, Dr. Uhrmann will oversee EVG’s entire sales organization, with responsibility for developing and executing EVG’s sales strategy, setting revenue targets, and leading the sales team to achieve them. He will report to Hermann Waltl, executive sales and customer support director at EVG. 

According to Waltl, “Thomas has been an integral part of EVG’s business operations success over the years, and we are excited to have him take on this new role at EVG, where his strong technical and business development background will further enhance our sales organization. His intimate knowledge of EVG’s core markets and solutions has been invaluable to our sales and other customer-facing functions, making him an ideal fit to oversee EVG’s worldwide sales efforts.”

Dr. Uhrmann is currently director of business development at EVG, a position he has held for more than 10 years where he has been responsible for overseeing all aspects of EVG’s worldwide business development with a focus on 3D integration, MEMS, LEDs and numerous emerging markets. Prior to this role, Dr. Uhrmann was business development manager for 3D and advanced packaging as well as compound semiconductors and silicon-based power devices at EVG. He holds an engineering degree in mechatronics from the University of Applied Sciences in Regensburg and a PhD in semiconductor physics from Vienna University of Technology. 

About EV Group (EVG)

EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. The company’s vison of being the first in exploring new techniques and supporting next-generation applications of micro- and nanofabrication technologies enables customers to successfully commercialize new product ideas. EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. More information about EVG is available at www.EVGroup.com.

Contacts:

Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

David Moreno
Principal
Open Sky Communications
Tel: +1.415.519.3915
E-mail: dmoreno@openskypr.com