The HERCULES® is a high-volume platform integrating the entire lithography process flow in one system, reducing process footprint and operator support.
Based on a modular platform, the HERCULES combines EVG’s established optical mask alignment technology with integrated wafer cleaning, resist coating, baking and resist development modules. The HERCULES enables cassette-to-cassette processing of various wafer sizes. The HERCULES safely handles thick, highly bowed, rectangular, small-diameter wafers or even device trays. Precision top-side and bottom-side alignment as well as coating of sub-micron to ultra-thick (up to 300 microns) resists can be applied for interlayer and passivation applications. The superior alignment stage design achieves highly accurate alignment and exposure results at high throughput.
Features
- Production platform combines all advantages of EVG’s precision alignment and resist processing systems in a minimized footprint
- Versatile platform supports fully automated processing of various substrate shapes, sizes, highly warped mold wafers and even trays
- Coating of up to 52,000 cP enables manufacturing of ultra-thick resist features of up to 300 microns in height
- CoverSpinTM rotating cover for low resist consumption and optimized resist coating uniformity
- OmniSpray® coating for optimized coating of high topography surfaces
- NanoSpray® for coating and protection of via structures
- Automated mask handling and storage
- Optical edge exposure and/or solvent cleaning for edge bead removal
- Fragile, thin or warped wafer handling of multiple wafer sizes with bridge-tool system
- Rework sorting wafer management and flexible cassette system
- Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
Technical Data
| Alignment modes |
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| Top side alignment: ≤ ± 0,5 µm |
| Bottom side alignment: ≤ ± 1,0 µm |
| IR alignment: ≤ ± 2,0 µm/ substrate material depending |
| Advanced alignment features |
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| Manual alignment |
| Automatic alignment |
| Dynamic alignment |
| Alignment offset correction |
| Automatic cross correction / manual cross correction |
| Large gap alignment |
| Industrial automation features |
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| Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling |
| Exposure source |
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| Mercury light source / UV LED light source |
| Exposure setup |
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| Vacuum contact / hard contact / soft contact / proximity mode / flex mode |
| Wedge compensation |
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| Fully automatic - SW controlled |
| Contactless |
| Exposure options |
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| Interval exposure / flood exposure / sector exposure |
| System control |
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| Operations system: Windows |
| File sharing & back-up solution / unlimited no. recipes & parameters |
| Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |
| Real-time remote access, diagnostics & troubleshooting |
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