Automated bond alignment system for wafer-to-wafer alignment for research and pilot production
Known for its high level of automation and reliability, the EVG620 bond alignment system offers high precision, flexibility and ease of use in numerous production environments. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Features
- Most suitable for EVG®501, EVG®510, and EVG®520 IS bonding systems
- Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
- Manual or motorized alignment stage
- Fully motorized high-resolution bottom-side microscopes
- Windows® based user interface
- Quick tool change between different wafer sizes and different bonding applications
- Options
- Automatic alignment
- IR alignment for inner substrate key alignment
- NanoAlign® package for enhanced process capabilities
- Available with system rack
- Upgrade possibility to mask aligner
Technical Data
| General system configuration |
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| Desktop |
| System rack: optional |
| Vibration isolation: passive |
| Alignment methods |
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| Backside alignment: ± 2 µm 3 σ |
| Transparent alignment: ± 1 µm 3 σ |
| IR alignment: option |
| Alignment stage |
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| Precision micrometers: manual |
| Optional: motorized micrometers |
| Wedge compensation: automated |
| Substrate / Wafer parameters |
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| Size: 2", 3", 100 mm, 150 mm |
| Thickness: 0,1 - 10 mm |
| Max. stack height: 10 mm |
| Automatic alignment |
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| Optional |
| Handling system |
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| Standard: 3 cassette stations |
| Optional: up to 5 stations |
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