Bonding

EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging.

Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.

With the invention of the world’s first double-sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process.

Fusion or direct wafer bonding enables permanent connection via dielectric layers on each wafer surface used for engineered substrate or layer transfer such as backside illuminated CMOS image sensors.Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing for face-to-face connection of wafers. The main application for hybrid bonding is in advanced 3D device stacking.

Several different D2W bonding methods are available and supported by EVG depending upon the application and customer requirements