Die-to-Wafer Bonding Systems
Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
Choose your Die-to-Wafer Bonding System
EVG®320 D2W
Automated Die Preparation and Activation System
Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) die-to-wafer (D2W) bonding
GEMINI® FB Automated Fusion Wafer Bonding System Configured for Die-to-Wafer Bonding
Automated Collective Die-to-Wafer Bonding System
High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding
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Die-to-Wafer Bonding
