Integrated modular high-volume manufacturing system for aligned wafer bonding
The GEMINI is a state-of-the-art, fully automated production wafer bonding system that integrates wafer-to-wafer alignment and bonding processes in a modular design. This platform is particularly suited for next-generation MEMS (Micro-Electro-Mechanical Systems) manufacturing up to 300 mm, offering exceptional performance in wafer-level vacuum or overpressure encapsulation but also in advanced system integration. Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the GEMINI equipment platform includes up to four bond chambers that ensure excellent bond quality and yield. The equipment provides full flexibility and supports a wide range of processes, including metal, anodic, glass-frit, fusion, and adhesive bonding.
Features
- Fully automated and integrated wafer bonding platform
- Field-proven SmartView® bond alignment system
- Bond force up to 350 kN
- High bond pressure uniformity
- Rapid heating and cooling
- Optimized temperature uniformity
- High vacuum and overpressure capability
- Accurate chamber pressure control
- Modular concept for full process flexibility
- Smart process control and data analysis
- Simplified, user-friendly interface
Technical Data
200 mm GEMINI®
- Wafer sizes from 100 mm to 200 mm
- Bond force up to 100 kN
- Up to 4 bond modules
- Overpressure capability up to 3000 mbar
- Different system layouts with up to 4 pre-process modules
- EVG load ports or SMIF load ports
300 mm GEMINI®
- Wafer sizes from 200 mm to 300 mm
- Bond force up to 350 kN
- Up to 4 bond modules
- Overpressure capability up to 2000 mbar
- Different system layouts with 2 to 6 pre-process modules
- FOUP load ports (optional adapter for 200 mm substrates)
- EFEM
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