Integrated modular high-volume manufacturing system for aligned wafer bonding
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
Features
- Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
- Configuration options for bottom-side or SmartView alignment
- Multiple bonding chambers
- Wafer handling system is separated from bond chuck handling system
- Modular design with swap-in modules
- Combines all benefits from EVG's precision aligners and EVG®500 series systems
- Minimized footprint compared to stand-alone systems
- Optional process modules:
- LowTemp™ plasma activation
- Wafer cleaning
- Coat module
- UV bond module
- Bake/chill modules
- Alignment verification module
Technical Data
| Maximum heater size |
|---|
| 150, 200, 300 mm |
| Loading chamber |
|---|
| 5-axis robot |
| Max. bond modules |
|---|
| 4 |
| Max. pre-processing modules |
|---|
| 200 mm: 4 |
| 300 mm: 6 |
Related downloads
Talk to our EVG product experts!
Questions?
Questions about our products and technologies?
Contact the EVG experts