Fully automated temporary wafer bonding of a substrate on a rigid carrier
The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process.
Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.
Features
- Open adhesive platform
- Various carriers (silicon, glass, sapphire, etc…)
- Bridge tool capability for different substrate sizes
- Available with multiple load port options and combinations
- Recipe controlled system
- Real time monitoring and recording of all relevant process parameters
- Fully integrated SECS/GEM interface
- Optional integrated inline metrology module for automated feedback loop
Technical Data
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm, oversized carrier possible |
| Different substrate / carrier combinations |
| Configuration |
|---|
| Coat module |
| Bake module with multiple hot plates |
| Align module with optical or mechanical alignment |
| Bond module |
| Options |
|---|
| Inline Metrology |
| ID reading |
| High topography wafer handling |
| Warped wafer handling |
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