Fully automated debonding, cleaning and unloading of thin wafers
The EVG®850 DB is a fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks. The fragile device wafers are always supported either through film frame mounting or through a thin wafer handler.
Features
- Reliable handling of thinned, bowed and warped wafers with and without topography
- Automated cleaning of debonded wafer
- Recipe controlled system
- Real time monitoring and recording of all relevant process parameters
- Fully integrated SECS/GEM interface in automated tools
- Bridge tool capability for different substrate sizes
- Modular tool layout → throughput-optimized depending on specific process
Technical Data
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Up to 12“ film frame |
| Configuration |
|---|
| Debond module |
| Clean module |
| Film frame mounter |
| Options |
|---|
| ID reading |
| Various output formats |
| High topography wafer handling |
| Warped wafer handling |
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