Single or dual chamber wafer bonding system for low volume production
The EVG520 IS is well suited for small-volume-production applications. Redesign based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as excellent temperature and force uniformity, high-force-bonding capability, and the same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes.
Features
- Fully automated processing with manual loading and unloading including external cooling station
- Compatible with EVG mechanical and optical aligners
- Single- or double-chamber automated system
- Fully automated bond process execution and bond cover movements
- Integrated cooling station for high throughput
- Options:
- High vacuum capability (1E-6 mbar)
- Programmable mass flow controller
- Integrated cooling
Technical Data
| Max Contact Force |
|---|
| 10, 20, 60, 100 kN |
| Heater size | 150 mm | 200 mm |
|---|---|---|
| Minimum substrate dimension | single chips | 100 mm |
| Vacuum |
|---|
| Standard: 1E-5 mbar |
| Optional: 1E-6 mbar |
| Max. temperature (°C) |
|---|
| Standard: 550 |
| Optional: 650 |
| Single chips processing |
|---|
| Yes |
| Bond chuck system / Alignment system |
|---|
| 150 mm heater: EVG®610, EVG®620, EVG®6200 |
| 200 mm heater: EVG®6200, SmartView® NT |
| Active water cooling |
|---|
| Top and bottom |
| Power supply for anodic bonding |
|---|
| Max. voltage: 2 kV |
| Max. current: 50 mA |
| Loading chamber |
|---|
| Manual |
| Max. bond chambers |
|---|
| 2 |
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