Fully automated wafer bonding system for substrates up to 300 mm
The EVG540 system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D-interconnect and MEMS applications. Based on a modular design, the EVG540 provides a proven solution for future transition of wafer bonding processes from R&D to large-scale manufacturing on our fully integrated production bonding systems.
Features
- Single-chamber bonder up to 300 mm substrate size
- Compatible with SmartView® and MBA300
- Automatic handling of up to four bond chucks
- Compliant to high safety standards
Technical Data
| Maximum heater size |
|---|
| 300 mm |
| Loading chamber |
|---|
| 2-axis robot |
| Max. bond chambers |
|---|
| 1 |
Talk to our EVG product experts!
Questions?
Questions about our products and technologies?
Contact the EVG experts