Layer Release Systems

EVG's IR LayerRelease Technology is a fully front-end-compatible layer release technology that features an infrared (IR) laser that can pass through silicon, which is transparent to the IR laser wavelength. Coupled with the use of specially formulated inorganic layers, this technology enables an IR laser-initiated release of any ultra-thin film or layer from silicon carriers with nanometer precision.

IR LayerRelease Technology enables silicon wafer carriers in advanced packaging processes such as Fan-out Wafer-level Packaging (FoWLP) using mold and reconstituted wafers as well as interposers for 3D Stacked ICs (3D SIC). At the same time, its compatibility with high-temperature processes enables completely novel process flows for 3D IC and 3D sequential integration applications – enabling hybrid and fusion bonding even of ultra-thin layers on silicon carriers, thereby revolutionizing 3D and heterogeneous integration as well as material transfer in next-generation scaled transistor designs.